Design of an intelligent vision inspection system for quality control in semiconductor industry

Abstract

This is the second project of the Program entitled “Design and Development of an Intelligent Vision Software with Integrated Automated Systems and their Applications”. Unlike the first project of the program (Project Code 74503) the primary objective was to develop a PC-based engine for vision system development. In this project the focus is towards applying the in-house developed image processing library or better known as VSDP for quality control inspection in the semiconductor industry. Other than applying image processing techniques, feature extraction and artificial intelligence techniques were also applied in this project. This project involves research and data collection in identifying faults of semiconductors; especially in 4 key quality aspects of a semiconductor IC, which are (1) Marking Quality, (2) Lead Quality, (3) Package Quality and (4) Post Die Attach Quality.