Thermal-aware dynamic weighted adaptive routing algorithm for 3D network-on-chip

Abstract

3D Network-on-Chip NoC based systems have severe thermal problems due to the stacking of dies and disproportionate cooling efficiency of different layers. While adaptive routing can help with thermal issues, current routing algorithms are either thermally imbalanced or suffer from traffic congestion. In this work a novel thermal aware dynamic weighted adaptive routing algorithm has been proposed that takes traffic and temperature information into account and prevents packets being routed across congested and thermally aggravated areas. Dynamic weighted model will consider parameters related to congestion and thermal issues and provide a balanced suitable approach according to the current scenario at each node. The efficiency of the proposed algorithm is analyzed and evaluated with state-of-the-art thermal-aware routing algorithms using a simulation environment. Results obtained from the simulation shows that the proposed algorithm has performed better in terms of global average delay with 17-33 percent improvement and better thermal profiling under various synthetic traffic conditions.