Study on thermal characteristic of oscilloscope with new from factor design

Abstract

Nowadays, electronic products require certain specifications to be met in order to compete in the world market. In this study, a new form factor for oscilloscope will be determined using numerical approach. For cost effective, parts standardization will be applied. The study involves analysis on the current oscilloscope and new form factor to meet the market specifications will be determined via numerical approach. This study focuses on the heat transfer within the enclosure of the oscilloscope. The analysis is required due to the fact that the components have to be rearranged in the new design to satisfy heat transfer requirement. The results show new form factor of 9m-1 as compared to 1 m-1 for the current oscilloscope. The analysis on the heat transfer shows that the design meets the product specifications. The new product is also found to be able to operate using current fan system.