Universiti Teknologi Malaysia Institutional Repository

Electronics system thermal management optimization using finite element and nelder-mead method

Ab. Majid, N. K. and Ismail, F. S. (2019) Electronics system thermal management optimization using finite element and nelder-mead method. Telkomnika (Telecommunication Computing Electronics and Control), 17 (5). pp. 2268-2275. ISSN 1693-6930


Official URL: https://dx.doi.org/10.12928/TELKOMNIKA.v17i5.12796


The demand for high-performance, smaller-sized, and multi-functional electronics component poses a great challenge to the thermal management issues in a printed circuit board (PCB) design. Moreover, this thermal problem can affect the lifespan, performance, and the reliability of the electronic system. This project presents the simulation of an optimal thermal distribution for various samples of electronics components arrangement on PCB. The objectives are to find the optimum components arrangement with minimal heat dissipation and cover small PCB area. Nelder-Mead Optimization (NMO) with Finite Element method has been used to solve these multi-objective problems. The results show that with the proper arrangement of electronics components, the area of PCB has been reduced by 26% while the temperature of components is able to reduce up to 40%. Therefore, this study significantly benefits for the case of thermal management and performance improvement onto the electronic product and system.

Item Type:Article
Uncontrolled Keywords:finite element method, nelder-mead method, optimization
Subjects:T Technology > TK Electrical engineering. Electronics Nuclear engineering
Divisions:Electrical Engineering
ID Code:89744
Deposited By: Narimah Nawil
Deposited On:22 Feb 2021 09:45
Last Modified:22 Feb 2021 09:45

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