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Electron microscopy study of grain boundary behavior in Pb-free solder materials for mitigation of whiskers

Kuwano, N. and Horikami, S. and Linas, M. (2015) Electron microscopy study of grain boundary behavior in Pb-free solder materials for mitigation of whiskers. Materials Science Forum, 827 . pp. 341-346. ISSN 0255-5476

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Item Type:Article
Subjects:A General Works
ID Code:59248
Deposited By: Haliza Zainal
Deposited On:18 Jan 2017 09:50
Last Modified:19 Jan 2017 08:43

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