Beh , Keh Shin (2004) Substrate warpage analysis during solder reflow process. Masters thesis, Universiti Teknologi Malaysia, Faculty of Mechanical Engineering.
Full text not available from this repository.
Official URL: http://libraryopac.utm.my/client/en_AU/main/search...
| Item Type: | Thesis (Masters) |
|---|---|
| Additional Information: | Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2004 |
| Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering |
| Divisions: | Mechanical Engineering |
| ID Code: | 42539 |
| Deposited By: | Haliza Zainal |
| Deposited On: | 02 Nov 2014 02:37 |
| Last Modified: | 25 Sep 2017 12:47 |
Repository Staff Only: item control page
