Universiti Teknologi Malaysia Institutional Repository

Image analysis on wire bonding

Mohd. Noor, Norliza (2005) Image analysis on wire bonding. Project Report. Universiti Teknologi Malaysia, Kuala Lumpur. (Unpublished)

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A software was created to calculate the intermetallic area in the MATLAB software environment. The software able to give an exact percentage of the intermetallic area using 2 methods that is %1M - based on normal-normal mixture modeling and gammagamma mixture modeling. The software also gives a compactness number where a low value means good compact of the intermetallic area and high value means bad. Compactness will give user an indication on the quality of the wire bonding.

Item Type:Monograph (Project Report)
Subjects:T Technology > TK Electrical engineering. Electronics Nuclear engineering
Divisions:Electrical Engineering
ID Code:2968
Deposited By: Adil Mohamad
Deposited On:21 May 2007 08:46
Last Modified:31 Jul 2017 03:48

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