Daud, Noor Dzulaikha and Nafea, Marwan and Mohamed Ali, Mohamed Sultan (2021) Finite element analysis of material removal rate for Si wafer using heat-assisted µEDM. ELEKTRIKA- Journal of Electrical Engineering, 20 (2-2). pp. 15-19. ISSN 0128-4428
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Official URL: https://elektrika.utm.my/index.php/ELEKTRIKA_Journ...
Abstract
Micro-electrical discharge machining (µEDM) has been proved to produce high surface quality results in Si machining. In previous studies, the researchers reported the Si machining using the µEDM with several strategies such as plating, doping and temporary coating process to be machined by the µEDM. This paper reports a numerical simulation of MRR performance results using COMSOL Multiphysics. The effects of the machining temperature in Si machining using heat-assisted µEDM on achieving the optimum MRR results is studied. The simulation results showed the highest MRR is 1.48666 × 10-5 mm3/seconds achieved at 250 °C.
| Item Type: | Article |
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| Uncontrolled Keywords: | heat-assisted μEDM, machining, material removal rate, numerical simulation, silicon wafer |
| Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering |
| Divisions: | Electrical Engineering |
| ID Code: | 97816 |
| Deposited By: | Yanti Mohd Shah |
| Deposited On: | 02 Nov 2022 09:45 |
| Last Modified: | 02 Nov 2022 09:45 |
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