IPC-A-610 standard in electric and electronic laboratory for engineering students: a systematic literature review

Abstract

Printed circuit board (PCB) creates platform for the majority of the electronic component placement. Component connectivity has been converted from manual soldering to surface mount technology (SMT) or well known as a solder paste technology. Even though SMT has conquered the electronics era in recent decades; manual soldering still plays a significant part behind the scene. Introduction of instruments such as Six Sigma and Total Quality Management emphasis on minimizing the frequency of occurrence of defects. Since defects cannot be eliminated but can be reduced; the method called rework and troubleshooting carries weight to repair the faulty components turn into good components. In this context, it is most welcome to repair the defective Printed Circuit Board Assembly (PCBA) by using "manual soldering" because manual soldering can be carried out immediately without queuing in the soldering oven (James et al., 2019). The goal of this study is to construct standard understanding of International Patent Classification (IPC) among Malaysian engineering students during their practical activity in engineering laboratory. Currently, end consumers prefer to repair the electronics gadget instead of buying the fresh units. In addition, purchasing repaired device becomes popular among clients who prefer to own more than one device such as mobile phone, laptop, tablet and other electronic gadgets. Therefore, IPC expertise will assist the repairer make a choice on the repaired units without relying on In-Circuit-Test (ICT) and Functionality-Circuit-Test(FCT).