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Simulating damage mechanics of electromigration and thermomigration

Shidong, Li and Abdul Hamid, Mohd. F. and Basaran, Cemal (2008) Simulating damage mechanics of electromigration and thermomigration. Simulation: Transactions of The Society for Modelling and Simulation Int., 84 (8-9). pp. 391-401. ISSN 0037-5497

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Official URL: http://dx.doi.org/10.1177/0037549708094856


Electromigration (EM) and thermomigration (TM) are processes of mass transport which are critical reliability issues for next generation nanoelectronics and power electronics. The purpose of this project is to develop a computational tool for simulating damage mechanics of EM and TM and their interaction. In this paper, a model for EM and TM processes is proposed and has been implemented in a general purpose finite-element code. The governing equations utilized for the model include mass conservation, force equilibrium, heat transfer and electricity conduction. A damage evolution model based on thermodynamics is introduced to evaluate the degradation in solder joints subjected to high current densities and high temperature gradients. The simulation results are compared with experimental data to validate the model.

Item Type:Article
Uncontrolled Keywords:electromigration, damage mechanics, nanoelectronics packaging, thermodynamics, thermomigration
Subjects:T Technology > TJ Mechanical engineering and machinery
Divisions:Mechanical Engineering
ID Code:8602
Deposited By: Norshiela Buyamin
Deposited On:06 May 2009 04:38
Last Modified:06 May 2009 04:38

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