Universiti Teknologi Malaysia Institutional Repository

Thermomigration induced degradation in solder alloys

Basaran, C. and S., Li and Abdul Hamid, M. F. (2008) Thermomigration induced degradation in solder alloys. American Institute of Physics, 103 (12). pp. 1-9. ISSN 1070-664X

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Official URL: http://dx.doi.org/10.1063/1.2943261

Abstract

Miniaturization of electronics to the nanoscale brings new challenges. Because of their small size and immense information and power processing capacity, large temperature gradients exist across nanoelectronics and power electronics solder joints. In this paper, a fully coupled thermomechanical-diffusion model is introduced to study the thermomigration induced strength degradation. A nonlinear viscoplastic material model with kinematic and isotropic hardening features is utilized. The model takes into account microstructural evolution of the material. A grain coarsening capability is built into the model to study its influence on thermomigration in solder alloys. The model is validated by comparing the simulation results with experimental data.

Item Type:Article
Uncontrolled Keywords:nanoelectronics, power electronics, solders, viscoplasticity
Subjects:T Technology > TJ Mechanical engineering and machinery
Divisions:Mechanical Engineering
ID Code:8489
Deposited By: Norshiela Buyamin
Deposited On:05 May 2009 05:17
Last Modified:02 Jun 2010 01:55

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