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Diamond turning of soft semiconductors to obtain nanometric mirror surfaces

Venkatesh, Vasisht,C. and Fang, Fengzhou Z. and Zhang, G.X. (2002) Diamond turning of soft semiconductors to obtain nanometric mirror surfaces. International Journal of Advanced Manufacturing Technology, 19 (9). pp. 637-641. ISSN 0268-3768

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Official URL: http://dx.doi.org/10.1007/s001700200107

Abstract

Diamond cutting is a viable alternative to grinding and polishing in the fabrication of high-quality soft semiconductors. Investigation of indentation provides useful information for understanding the practical diamond cutting process of brittle materials. Cutting forces and temperatures were analysed using a Kistler dynamometer and an infrared technique. A zero rake angle cutting tool was found to be most efficient, partly because the effective rake is really a strong negative rake brought about by the peculiar configuration of very low feeds and depths of cut. This is explained by means of the comparison of the force distribution between conventional turning and ultraprecision machining. Atomic force microscopy and scanning electron microscopy were used to study the surfaces. Zinc sulfide gave subnanometric surfaces (0.88 m) and zinc selenide gave Ra values of 2.91 nm.

Item Type:Article
Uncontrolled Keywords:Diamond turning, nanometric surfaces, soft semi-conductors
Subjects:T Technology > TP Chemical technology
Divisions:Chemical and Natural Resources Engineering (Formerly known)
ID Code:7388
Deposited By: Maznira Sylvia Azra Mansor
Deposited On:02 Jan 2009 07:44
Last Modified:01 Jun 2010 15:51

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