Universiti Teknologi Malaysia Institutional Repository

Factors identification on optimization of ball placement tool for flip-chip- ball-grid-array product

Ismail, A. and Dolah, R. and Miyagi, Z. (2016) Factors identification on optimization of ball placement tool for flip-chip- ball-grid-array product. Jurnal Teknologi, 78 (1). pp. 175-179. ISSN 0127-9696

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Abstract

Market demand on system-on-chip (SoC) using ball-attach technologies, it is time for ball-attach module to have an improvement on their capabilities within limited resources (man and machine). This paper identifies caused of factor which contributes more time to production time. Justification on improving ball-attach module cycle time during high volume activities is explained.

Item Type:Article
Uncontrolled Keywords:Ball-attach, Equipment optimization
Subjects:T Technology > T Technology (General)
Divisions:Razak School of Engineering and Advanced Technology
ID Code:71717
Deposited By: Widya Wahid
Deposited On:21 Nov 2017 03:28
Last Modified:21 Nov 2017 03:28

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