Effects of non-spherical colloidal silica slurry on Al-NiP hard disk substrate CMP application

Abstract

Spherical and non-spherical colloidal silica size and shape were characterized and its effects on aluminum alloy nickel plated (Al-NiP) hard disk substrate during chemical mechanical polishing (CMP) was investigated. Non-spherical colloidal silica slurry shows significantly higher material removal rate (MRR) with higher coefficient of friction (CoF) when compared to spherical colloidal silica of similar size. CMP evaluations on non-spherical colloidal silica slurry particle size distribution (PSD) reveal that MRR can be further increased by using wider PSD. Conventional slurry for Al-NiP hard disk substrates which use alumina-silica composite slurry induces embedded alumina thermal asperities (TA) defects which can cause reliability failure at product level. CMP comparison between conventional alumina-silica slurry and non-spherical colloidal silica slurry shows substrates polished by using non-spherical colloidal silica slurry have no embedded TA defects, lower surface roughness and lower surface defects.