Fadil, Nor Akmal and Mior Shahidin, Shazatul Akmaliah (2015) Effect of hydrofluoric acid etching on electroless copper plating on silicon wafer. In: 4th International Conference on Advanced Manufacturing Technology (ICAMT 2015), 20-22 Sept, 2015, Johor Bahru, Johor.
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Official URL: http://www.icamt.net/
Abstract
Metallic coating such as copper film can be easily deposited on the semiconductor materials like silicon wafer substrate without prior surface pre-treatment. However, the adhesion of the copper film was very weak and easily peels off. In this study, the effect of etching in hydrofluoric acid solution as surface pre-treatment prior electroless plating on silicon wafer was studied. The etching time in hydrofluoric acid was varied at 1, 3 and 5 minutes in order to investigate the bonding behavior of coating layer. The surface morphology of electroless plated samples was observed by field emission scanning electron microscopy and the coating thickness was measured by optical microscopy. The results showed that by applying etching process, the bonding between the copper film and the substrate has been improved.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Uncontrolled Keywords: | surface pre-treatment, hydrofluoric acid etching |
| Subjects: | Q Science > QC Physics |
| Divisions: | Mechanical Engineering |
| ID Code: | 62148 |
| Deposited By: | Widya Wahid |
| Deposited On: | 14 May 2017 00:20 |
| Last Modified: | 14 May 2017 00:20 |
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