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Electron microscopy study of grain boundary behavior in Pb-free solder materials for mitigation of whiskers

Kuwano, N. and Horikami, S. and Linas, M. (2015) Electron microscopy study of grain boundary behavior in Pb-free solder materials for mitigation of whiskers. Materials Science Forum, 827 . pp. 341-346. ISSN 0255-5476

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Official URL: http://www.dx.doi.org/10.4028/www.scientific.net/M...

Abstract

The changes of microstructure in pure-Sn after deformation were investigated by electron microscopy. Two types of specimens were prepared: Sample-1; pure-Sn/Fe-42Ni, Sample-2; single crystalline pure-Sn. The growth of curling whiskers on Sample-1 was observed in-situ in a scanning electron microscope (SEM). A thin foil specimen of the curling whisker was made with a focused ion beam (FIB) mill. Transmission electron microscope (TEM) analysis confirmed that the curling whisker was of a single crystal regardless of its external shape. New models for growth process of a bent single-crystalline whisker were proposed. The models are composed of epitaxial growth and recrystallization. Electron back scatter diffraction (EBSD) analysis was performed for Sample-2. The results of EBSD strongly suggested that recrystallization proceeds even at room temperature. These experimental results are very important to understand the behavior of dynamical deformation and recrystallization of Sn metal, and useful in consideration the mitigation of whiskers.

Item Type:Article
Uncontrolled Keywords:deformation, electron microscopy, grain boundary
Subjects:T Technology > T Technology (General)
Divisions:Malaysia-Japan International Institute of Technology
ID Code:59248
Deposited By: Haliza Zainal
Deposited On:18 Jan 2017 01:50
Last Modified:19 Aug 2021 03:21

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