Hamid, M. F. A. and Tamin, M. N. (2015) A review of computational damage mechanics of mass transport in solder joint. In: 2014 36th IEEE International Electronics Manufacturing Technology Conference, IEMT 2014, 11 - 13 November 2014, Johor, Malaysia.
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Official URL: http://dx.doi.org/10.1109/IEMT.2014.7123121
Abstract
Motivated by the requirement of International Technology Roadmap for Semiconductors (ITRS), this article addresses ITRS modelling and simulation requirements particularly electromigration and thermomigration. The governing equations, material and damage mechanics models are discussed, finite element formulations are developed, and finally results from simulations and experiments are compared to validate simulation results.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Uncontrolled Keywords: | International Technology Roadmap for Semiconductors, electromigration |
| Subjects: | T Technology > TJ Mechanical engineering and machinery |
| Divisions: | Mechanical Engineering |
| ID Code: | 59117 |
| Deposited By: | Haliza Zainal |
| Deposited On: | 18 Jan 2017 01:50 |
| Last Modified: | 05 Apr 2022 06:26 |
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