Universiti Teknologi Malaysia Institutional Repository

Laser microwelding for reliable packaging of photonic devices

Fadhali, Mohamed and Toto, Saktioto and Zainal, Jasman and Munajat, Yusof and Ali, Jalil and Abd Rahman, Rosly (2007) Laser microwelding for reliable packaging of photonic devices. ISESCO International Workshop and Conference on Nonotechnology . p. 1.

[img]
Preview
PDF
13Kb

Abstract

Investigations and analysis of various parameters that contribute for increasing the efficiency of laser diode to single mode fiber coupling using lens coupling scheme are presented in this paper. The low power laser weldability of Invar, Kovar and stainless steel 304 alloys make them suitable as the best materials and welding tools to different types of photonic devices packaging. The fiber attachment process and microwelds for fixing of various coupling components have been performed in what is so called active alignment process, where the system continues measuring the coupled power during the process of coupling and welding system (LW4000S from Newport) has been used for the alignment and welding of the coupling components inside a butterfly module. The effect of laser weld beam parameters on the weld dimensions is optimized to get good and the desired weld width to penetration depth with small heat affected zone (HAZ) for achieving good welds without damaging the sensitive optical components inside the module.

Item Type:Article
Subjects:T Technology > T Technology (General)
Q Science > QC Physics
Divisions:Science
ID Code:5870
Deposited By: Azlin Abd. Jamil
Deposited On:08 Jul 2008 09:57
Last Modified:01 Jun 2010 15:36

Repository Staff Only: item control page