Sudin, Izman and Salleh, Sideq (2014) Effects of friction modifier additives on HDD substrate defects and surface topography during CMP. Advanced Materials Research, 845 . pp. 894-898. ISSN 1022-6680
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Official URL: http://dx.doi.org/10.4028/www.scientific.net/AMR.8...
Abstract
This study investigates the effects of Friction Modifier Additives (FMA) added into the polishing slurry on Aluminium Nickel Phosphorous plated (Al-NiP) Hard-Disk Drive (HDD) substrates surface topography and surface defects during Chemical Mechanical Polishing (CMP) process. It is confirmed that addition of Friction Modifier Additives into the slurry reduces the overall coefficient of friction (CoF) during CMP process. By increasing the FMA concentration in the polishing slurry, the substrate surface topography such as waviness and surface roughness were improved significantly. It also lowered the defects counts especially scratch and sub-micron damage as revealed under Optical Surface Analyser (OSA) and Atomic Force Microscope (AFM) analysis.
| Item Type: | Article |
|---|---|
| Uncontrolled Keywords: | chemical mechanical polishing, friction modifier additives, substrate defects, surface topography |
| Subjects: | T Technology > TJ Mechanical engineering and machinery |
| Divisions: | Mechanical Engineering |
| ID Code: | 52601 |
| Deposited By: | Siti Nor Hashidah Zakaria |
| Deposited On: | 01 Feb 2016 03:52 |
| Last Modified: | 26 Jun 2018 07:59 |
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