Ausordin, Siti Fatimah and Abdul Rahim, Sharul Kamal and Seman, Norhudah and Dewan, Raimi (2013) A compact 3-DB coupler on a dual substrate layer with a rectangular slotted microstrip ground plane. In: 2013 IEEE BUSINESS ENGINEERING AND INDUSTRIAL APPLICATIONS COLLOQUIUM (BEIAC 2013), 7-9 April 2013, Malaysia.
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Abstract
This paper presents a compact 3-dB coupler on a dual substrate layer with a rectangular slotted microstrip ground plane. The coupler is designed for operating frequency at 2.45 GHz using an inexpensive FR-4 substrate. A compact coupler design with dimension of 19 mm x 7.5 mm offers a size reduction of 62 % while simultaneously enhanced the bandwidth to 42.7 % compared to a conventional coupler.
Item Type: | Conference or Workshop Item (Paper) |
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Uncontrolled Keywords: | coupler |
Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering |
Divisions: | Others |
ID Code: | 50846 |
Deposited By: | Haliza Zainal |
Deposited On: | 27 Jan 2016 01:53 |
Last Modified: | 28 Sep 2017 03:33 |
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