Universiti Teknologi Malaysia Institutional Repository

Substrate warpage analysis during solder reflow process

Beh , Keh Shin (2004) Substrate warpage analysis during solder reflow process. Masters thesis, Universiti Teknologi Malaysia, Faculty of Mechanical Engineering.

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Item Type:Thesis (Masters)
Additional Information:Thesis (Sarjana Kejuruteraan (Mekanikal)) - Universiti Teknologi Malaysia, 2004
Subjects:T Technology > TK Electrical engineering. Electronics Nuclear engineering
Divisions:Mechanical Engineering
ID Code:42539
Deposited By: Haliza Zainal
Deposited On:02 Nov 2014 02:37
Last Modified:25 Sep 2017 12:47

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