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Development of vapor pressure in FR4-copper composite material during solder reflow process

Kamsah, Nazri and Tamin, Mohd. Nasir and Mohamed Kamar, Haslinda and Lahuri, Hidayatunnur and Wagiman, Amir Nur Rashid (2012) Development of vapor pressure in FR4-copper composite material during solder reflow process. In: 4th International Meeting of Advances in Thermofluids, IMAT 2011. American Institute of Physics, Melville, New York, pp. 116-123. ISBN 978-073541032-9

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Official URL: http://dx.doi.org/10.1063/1.4704209

Abstract

This paper presents a finite element (FE) methodology for predicting the distribution of vapor pressure in a simple FR4-copper composite material when it is heated up to 215°C. A general purpose finite element software was used to develop a two-dimensional plane strain model of the composite material. FE simulation of transient moisture absorption was performed to predict the distribution of wetness fraction in the material after pre-conditioning at an 85°C/85%RH environment for 15 days. FE simulation of transient moisture desorption was carried out at the peak solder reflow temperature of 215°C to predict new distribution of wetness fraction in the material. The results of the moisture desorption analysis were used to compute the magnitude of vapor pressure in the material and its distribution at 215°C. It was found that the moisture in the material redistributes itself during solder reflow. The moisture concentration in the area close to the FR4-copper interface below the longer copper trace increases during the solder reflow. The magnitude of the vapor pressure in 70% of the FR4 and near the FR4-copper interface below the lower copper trace is closed to the saturation pressure of water vapor at 215°C. The distribution of the vapor pressure in the material is in similar fashion as the new distribution of wetness fraction after the moisture desorption analysis.

Item Type:Book Section
Additional Information:Indexed by Scopus
Uncontrolled Keywords:Finite element simulation of moisture absorption, fr4-copper composite material, moisture desorption process, solder reflow process, vapor pressure development
Subjects:T Technology > TJ Mechanical engineering and machinery
Divisions:Mechanical Engineering
ID Code:35239
Deposited By:INVALID USER
Deposited On:30 Oct 2013 00:49
Last Modified:02 Feb 2017 05:42

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