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Modular architecture of a non-contact pinch actuation micropump

Pei, Song Chee and Arsat, Rashidah and Adam, Tijjani and Hashim, Uda and Abdul Rahim, Ruzairi and Pei, Leow Ling (2012) Modular architecture of a non-contact pinch actuation micropump. Sensors, 12 (9). pp. 12572-12587. ISSN 1424-8220

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Official URL: http://dx.doi.org/10.3390/s120912572

Abstract

This paper demonstrates a modular architecture of a non-contact actuation micropump setup. Rapid hot embossing prototyping was employed in micropump fabrication by using printed circuit board (PCB) as a mold material in polymer casting. Actuator-membrane gap separation was studied, with experimental investigation of three separation distances: 2.0 mm, 2.5 mm and 3.5 mm. To enhance the micropump performance, interaction surface area between plunger and membrane was modeled via finite element analysis (FEA). The micropump was evaluated against two frequency ranges, which comprised a low driving frequency range (0-5 Hz, with 0.5 Hz step increments) and a nominal frequency range (0-80 Hz, with 10 Hz per step increments). The low range frequency features a linear relationship of flow rate with the operating frequency function, while two magnitude peaks were captured in the flow rate and back pressure characteristic in the nominal frequency range. Repeatability and reliability tests conducted suggest the pump performed at a maximum flow rate of 5.78 mL/min at 65 Hz and a backpressure of 1.35 kPa at 60 Hz. © 2012 by the authors; licensee MDPI, Basel, Switzerland.

Item Type:Article
Uncontrolled Keywords:Hot embossing, Lab on chip
Subjects:T Technology > TK Electrical engineering. Electronics Nuclear engineering
Divisions:Electrical Engineering
ID Code:32925
Deposited By: Fazli Masari
Deposited On:31 Jul 2013 00:51
Last Modified:30 Nov 2018 06:33

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