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Interfacial reactions during soldering of lead-free solders on copper and nickel substrates

Idris, Siti Rabiatull Aisha (2012) Interfacial reactions during soldering of lead-free solders on copper and nickel substrates. PhD thesis, Universiti Teknologi Malaysia, Faculty of Mechanical Engineering.

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Item Type:Thesis (PhD)
Additional Information:Thesis (Ph.D (Kejuruteraan Mekanikal)) – Universiti Teknologi Malaysia, 2012; Supervisors : Prof. Dr. Ali Ourdjini, Assoc. Prof. Dr. Astuty Amrin
Subjects:Unspecified
Divisions:Mechanical Engineering
ID Code:32195
Deposited By: Kamariah Mohamed Jong
Last Modified:12 Jun 2013 07:54

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