Universiti Teknologi Malaysia Institutional Repository

Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes

Osman, Saliza Azlina (2012) Interfacial reactions between tin-silver-copper lead-free solders and nickel (P)/palladium/gold and nickel (B)/palladium/gold surface finishes. PhD thesis, Universiti Teknologi Malaysia, Faculty of Mechanical Engineering.

Full text not available from this repository.


Item Type:Thesis (PhD)
Additional Information:Thesis (Doktor Falsafah (Kejuruteraan Mekanikal)) - Universiti Teknologi Malaysia, 2012; Supervisors : Prof. Dr. Ali Ourdjini, Assoc. Prof. Dr. Astuty Amrin
Subjects:Unspecified
Divisions:Mechanical Engineering
ID Code:31358
Deposited By: Kamariah Mohamed Jong
Last Modified:07 May 2013 03:15

Repository Staff Only: item control page