Mohd. Noor, Norliza (2005) Image analysis on wire bonding. Project Report. Universiti Teknologi Malaysia, Kuala Lumpur. (Unpublished)
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Abstract
A software was created to calculate the intermetallic area in the MATLAB software environment. The software able to give an exact percentage of the intermetallic area using 2 methods that is %1M - based on normal-normal mixture modeling and gammagamma mixture modeling. The software also gives a compactness number where a low value means good compact of the intermetallic area and high value means bad. Compactness will give user an indication on the quality of the wire bonding.
| Item Type: | Monograph (Project Report) |
|---|---|
| Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering |
| Divisions: | Electrical Engineering |
| ID Code: | 2968 |
| Deposited By: | Adil Mohamad |
| Deposited On: | 21 May 2007 08:46 |
| Last Modified: | 31 Jul 2017 03:48 |
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