Adaptive active thermal control

Abstract

Electronic devices produce heat as a by-product of normal operation. When electrical current flows through a semiconductor or a passive device, a portion of the power is dissipated as heat energy. If we do not allow the heat to dissipate, the device junction temperature will exceed the maximum safe operating temperature specified by the manufacturer. Consequently, the quality, reliability and performance will be reduced and shorten the product’s life cycle. This is accomplished by implementing an active thermal control of the die-level temperature which is desirable during production testing of electronic devices, so as to ensure accurate performance classification. This project focuses on the controller design for active thermal control system. The controllers used to control the die temperature are proportional controller, proportional-integral controller and model reference adaptive control with proportional control structure. The performances of the entire controller have been compared. Therefore, after the analysis on comparison their performance be done; model reference adaptive control with proportional control structure give better performance compare to proportional controller and proportional-integral controller.