Universiti Teknologi Malaysia Institutional Repository

Frequency-controlled wireless shape-memory-alloy microactuators integrated using an electroplating bonding process

Mohamed Ali, Mohamed Sultan and K., Takahata (2010) Frequency-controlled wireless shape-memory-alloy microactuators integrated using an electroplating bonding process. Sensors and Actuators, A: Physical, 163 (1). 363 -372. ISSN 0924-4247

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Official URL: http://dx.doi.org/10.1016/j.sna.2010.08.007

Abstract

This paper reports the wireless control of bulk-micromachined shape-memory-alloy actuators using external radiofrequency magnetic fields and its application to microgrippers. The frequency-sensitive wireless resonant heater to which the gripper actuator is bonded is activated only when the field frequency is tuned to the resonant frequency of the heater. A batch-compatible bonding technique based on photo-defined copper electroplating is developed to mechanically and thermally couple the gripper with the planar heater circuit fabricated using copper-clad polyimide film. The actuation range of 600 µm as the tip opening distance is obtained with normally closed 5-mm long grippers at a device temperature of 92 °C. The field frequency range to which the devices with 140-MHz resonant frequency respond is measured to be ~13 MHz about the resonant frequency. The manipulation of vertically aligned carbon-nanotube forests is experimentally demonstrated. Mechanical stress tests for the bond formed by the developed electroplating bonding method show a shear strength greater than 40 MPa.

Item Type:Article
Uncontrolled Keywords:shape-memory-alloys, micro-electro-mechanical systems, actuators, grippers, wireless, electroplating, bonding
Subjects:T Technology > TK Electrical engineering. Electronics Nuclear engineering
Divisions:Electrical Engineering
ID Code:26157
Deposited By: Liza Porijo
Deposited On:28 Jun 2012 00:30
Last Modified:24 Aug 2014 08:56

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