Universiti Teknologi Malaysia Institutional Repository

Low CTE composite substrate material to improve warpage and solder joint reliability in electronic packaging

Tamin, M. N. and H., S. Pang (2006) Low CTE composite substrate material to improve warpage and solder joint reliability in electronic packaging. In: Conference On Manufacturing & Electronic Technology (COMET 2006), 2006, UTM.

Full text not available from this repository.


Item Type:Conference or Workshop Item (Paper)
Subjects:T Technology > TJ Mechanical engineering and machinery
Divisions:Mechanical Engineering
ID Code:25268
Deposited By: Liza Porijo
Deposited On:14 May 2012 06:55
Last Modified:14 May 2012 06:55

Repository Staff Only: item control page