Tamin, M. N. and H., S. Pang (2006) Low CTE composite substrate material to improve warpage and solder joint reliability in electronic packaging. In: Conference On Manufacturing & Electronic Technology (COMET 2006), 2006, UTM.
Full text not available from this repository.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | T Technology > TJ Mechanical engineering and machinery |
| Divisions: | Mechanical Engineering |
| ID Code: | 25268 |
| Deposited By: | Liza Porijo |
| Deposited On: | 14 May 2012 06:55 |
| Last Modified: | 14 May 2012 06:55 |
Repository Staff Only: item control page
