Universiti Teknologi Malaysia Institutional Repository

A mechanical approach for thermal reliability assessment of surface mount package

Tamin, M. N. and Liew, Y. B. (2006) A mechanical approach for thermal reliability assessment of surface mount package. In: Conference On Manufacturing & Electronic Technology (COMET 2006), 2006, UTM.

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Item Type:Conference or Workshop Item (Paper)
Subjects:T Technology > TJ Mechanical engineering and machinery
Divisions:Mechanical Engineering
ID Code:24744
Deposited By: Liza Porijo
Deposited On:24 Apr 2012 00:55
Last Modified:25 Apr 2012 04:51

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