Tamin, M. N. and Liew, Y. B. (2006) A mechanical approach for thermal reliability assessment of surface mount package. In: Conference On Manufacturing & Electronic Technology (COMET 2006), 2006, UTM.
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| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | T Technology > TJ Mechanical engineering and machinery |
| Divisions: | Mechanical Engineering |
| ID Code: | 24744 |
| Deposited By: | Liza Porijo |
| Deposited On: | 24 Apr 2012 00:55 |
| Last Modified: | 25 Apr 2012 04:51 |
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