Fong, Joyce Koh Swee and Ourdjini, Ali (2006) Effect of solder bump size on intermetallic compound formation during soldering on Ni-Au surface finish. In: Conference On manufacturing & Electronic Technology (COMET 2006), 2006, UTM.
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| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | T Technology > TJ Mechanical engineering and machinery |
| Divisions: | Mechanical Engineering |
| ID Code: | 24735 |
| Deposited By: | Liza Porijo |
| Deposited On: | 24 Apr 2012 00:50 |
| Last Modified: | 25 Apr 2012 04:23 |
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