Universiti Teknologi Malaysia Institutional Repository

Effect of solder bump size on intermetallic compound formation during soldering on Ni-Au surface finish

Fong, Joyce Koh Swee and Ourdjini, Ali (2006) Effect of solder bump size on intermetallic compound formation during soldering on Ni-Au surface finish. In: Conference On manufacturing & Electronic Technology (COMET 2006), 2006, UTM.

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Item Type:Conference or Workshop Item (Paper)
Subjects:T Technology > TJ Mechanical engineering and machinery
Divisions:Mechanical Engineering
ID Code:24735
Deposited By: Liza Porijo
Deposited On:24 Apr 2012 00:50
Last Modified:25 Apr 2012 04:23

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