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Effect of annealing and thermal aging on intermetallics formed between Sn-4Ag-0.5 Cu solder with different surface finishes

Azmah, H. M. A. and Oudjini, A. and Esah, H. (2006) Effect of annealing and thermal aging on intermetallics formed between Sn-4Ag-0.5 Cu solder with different surface finishes. In: Conference On manufacturing & Electronic Technology (COMET 2006), 2006, UTM.

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Item Type:Conference or Workshop Item (Paper)
Subjects:T Technology > TJ Mechanical engineering and machinery
Divisions:Mechanical Engineering
ID Code:24712
Deposited By: Liza Porijo
Deposited On:24 Apr 2012 00:35
Last Modified:25 Apr 2012 02:45

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