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Effect of reflow soldering and isothermal aging on interfacial microstructure between lead-free solder alloy and different surface finishes

Tan, C. L. and Ourdjini, A. and Esah, H. (2006) Effect of reflow soldering and isothermal aging on interfacial microstructure between lead-free solder alloy and different surface finishes. In: Conference On manufacturing & Electronic Technology (COMET 2006), 2006, UTM.

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Item Type:Conference or Workshop Item (Paper)
Subjects:T Technology > TJ Mechanical engineering and machinery
Divisions:Mechanical Engineering
ID Code:24690
Deposited By: Mrs Liza Porijo
Deposited On:24 Apr 2012 00:33
Last Modified:25 Apr 2012 02:38

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