Ourdjini, Ali and Azmah Hanim, M. A. and Joyce Koh, S. F. and K., I. Siti Aisha (2006) Effect of solder volume on interfacial reactions between eutectic sn-pb and sn-ag-cu solderand ni(p)-au surface finish. In: 31st International Conference on Electronics Manufacturing and Technology, 2006, Sunway Resort Hotel, Petaling Jaya.
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| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | T Technology > TJ Mechanical engineering and machinery |
| Divisions: | Mechanical Engineering |
| ID Code: | 24672 |
| Deposited By: | Liza Porijo |
| Deposited On: | 23 Apr 2012 05:00 |
| Last Modified: | 24 Apr 2012 04:09 |
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