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Effect of solder volume on interfacial reactions between eutectic sn-pb and sn-ag-cu solderand ni(p)-au surface finish

Ourdjini, Ali and Azmah Hanim, M. A. and Joyce Koh, S. F. and K., I. Siti Aisha (2006) Effect of solder volume on interfacial reactions between eutectic sn-pb and sn-ag-cu solderand ni(p)-au surface finish. In: 31st International Conference on Electronics Manufacturing and Technology, 2006, Sunway Resort Hotel, Petaling Jaya.

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Item Type:Conference or Workshop Item (Paper)
Subjects:T Technology > TJ Mechanical engineering and machinery
Divisions:Mechanical Engineering
ID Code:24672
Deposited By: Liza Porijo
Deposited On:23 Apr 2012 05:00
Last Modified:24 Apr 2012 04:09

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