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Effect of solder volume on interfacial reactions between eutectic sn-pb and sn-ag-cu solderand ni(p)-au surface finish

Ourdjini, Ali and Azmah Hanim, M. A. and Joyce Koh, S. F. and K., I. Siti Aisha (2006) Effect of solder volume on interfacial reactions between eutectic sn-pb and sn-ag-cu solderand ni(p)-au surface finish. In: 31st International Conference on Electronics Manufacturing and Technology, 2006, Sunway Resort Hotel, Petaling Jaya.

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In this study, interfacial reactions between eutectic Sn-Pb and Sn-Ag-Cu with different solder volumes and electroless nickel/immersion gold (ENIG) surface finish are investigated. Soldering on copper finish has also been investigated for reference. Three differenLt solder ball sizes (300, 500 and 700 µm) were used on the substrate surface finish pads with a diameter of 380 µm. The effect of solid state thermal ageing is also examined, focusing on the type of intermetallic compound (IMC) formed, the IMC thickness and growth rates. The results revealed that the solder volume has a significant effect on the thickness of intermetallics formed at the solder joints. The intermetallic formed in the solder with smaller volume was observed to be thicker than that in the solder with larger volume. It was also found that the eutectic Sn-Pb solder forms a thicker intermetallic and a, much greater intermetallic growth rate compared to the Sn-Ag-Cu solder. Examination of solder joints microstructures revealed that several types and morphologies of intermetallics formed after reflow soldering and solid state ageing. However, the solder bump volume has no effect on the intermetallics types or morphologies. For the eutectic Sn-Pb solder, mainly Ni3Sn4 and Ni3Sn2 intermetallics formed at the solder joints whereas in the Sn-Ag-Cu solder joints (Cu, Ni)6Sn5 and (Ni, CU)3Sn4 were observed. The investigation also revealed that more Ag3Sn intermetallics were observed just ahead of the solider joint interface and in the bulk of the Sn-Ag-Cu solder with the larger volume (solder ball with diameter of 700 µm).

Item Type:Conference or Workshop Item (Paper)
Uncontrolled Keywords:ageing copper alloys eutectic alloys lead alloys reflow soldering silver alloys solders surface finishing tin alloys
Subjects:T Technology > TJ Mechanical engineering and machinery
Divisions:Mechanical Engineering
ID Code:24672
Deposited By: Mrs Liza Porijo
Deposited On:23 Apr 2012 05:00
Last Modified:07 Feb 2017 07:05

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