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Application of signal analysis techniques for condition monitoring of a wire bonding machine

Ahmad, Puteri Aidawati and Sha'ameri, Ahmad Zuri and Sheikh Salleh, Sheikh Hussein and Mohd Badar, Omar and Mohd Hani, Mohammed Khalil (2000) Application of signal analysis techniques for condition monitoring of a wire bonding machine. TENCON 2000. Proceedings, 2 (3 vol.(xxv+536+614+527) ). pp. 372-376.

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Abstract

This paper investigates the technique to monitor the condition of a wire bonding machine that used in the integrated manufacturing (IC) industry. The machine forms the connection between the bonding pad on the die to the contacts of the leadframe. To ensure consistency in the process, defects in the bondhead subassembly can be monitored from the damping signature. For this purpose, the analysis techniques chosen are the correlation function and power spectrum estimation. Thus, the main objective of this paper is to find the signal analysis technique that can uniquely represent the good from the defective machine signatures

Item Type:Article
Subjects:T Technology > TK Electrical engineering. Electronics Nuclear engineering
Divisions:Electrical Engineering
ID Code:2326
Deposited By: Dr Zaharuddin Mohamed
Deposited On:11 Apr 2007 07:46
Last Modified:01 Jun 2010 03:02

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