Yek Ban, Liew (2004) Evolution of internal states in a Sn-Pb solder joint during and thermal cycle. In: International Conference on Electronic Material And Packaging, 2004, n/a.
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| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | Unspecified |
| Divisions: | Others |
| ID Code: | 20871 |
| Deposited By: | Liza Porijo |
| Last Modified: | 28 Dec 2011 15:56 |
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