Universiti Teknologi Malaysia Institutional Repository

Deformation and stresses in electronic package due to thermal cycling

Lai, Zheng Bo and Kamsah, Nazri (2008) Deformation and stresses in electronic package due to thermal cycling. In: Advances in Thermo-Fluids. Penerbit UTM , Johor. ISBN 978-983-52-0541-5

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Item Type:Book Section
Subjects:T Technology > TK Electrical engineering. Electronics Nuclear engineering
Divisions:Mechanical Engineering
ID Code:19286
Deposited By: Ms Zalinda Shuratman
Deposited On:14 Jan 2012 05:02
Last Modified:14 Jan 2012 05:02

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