Lai, Zheng Bo and Kamsah, Nazri (2008) Deformation and stresses in electronic package due to thermal cycling. In: Advances in Thermo-Fluids. Penerbit UTM , Johor. ISBN 978-983-52-0541-5
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| Item Type: | Book Section |
|---|---|
| Subjects: | T Technology > TK Electrical engineering. Electronics Nuclear engineering |
| Divisions: | Mechanical Engineering |
| ID Code: | 19286 |
| Deposited By: | Zalinda Shuratman |
| Deposited On: | 14 Jan 2012 05:02 |
| Last Modified: | 14 Jan 2012 05:02 |
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