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Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish

Osman, Saliza Azlina (2008) Intermetallic compound formation between Sn - 37Pb & Sn - Ag - Cu lead - free solders and immersion silver surface finish. Masters thesis, Universiti Teknologi Malaysia, Faculty of Mechanical Engineering.

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Item Type:Thesis (Masters)
Additional Information:Supervisor : Assoc. Prof. Dr Ali Ourdjini; Thesis (Sarjana Kejuruteraan (Mekanikal - Bahan))- Universiti Teknologi Malaysia, 2008
Subjects:T Technology > TJ Mechanical engineering and machinery
Divisions:Mechanical Engineering
ID Code:18046
Deposited By: Kamariah Mohamed Jong
Last Modified:18 Nov 2011 04:30

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