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Thermally-induced strain in FCBGA microelectronics package subjected to transient temperature loading

Kamsah, Nazri and Mohd. Top, Nurul Nadiah (2009) Thermally-induced strain in FCBGA microelectronics package subjected to transient temperature loading. In: The 2nd International Meeting on Advances in Thermo-Fluids (IMAT) 2009 , 2009, Taman Safari, Bogor, Indonesia.

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Official URL: http://research.eng.ui.ac.id/news/read/35/the-inte...


Item Type:Conference or Workshop Item (Paper)
Subjects:T Technology > TP Chemical technology
Divisions:Mechanical Engineering
ID Code:16064
Deposited By: Mrs Liza Porijo
Deposited On:18 Oct 2011 09:46
Last Modified:24 Jul 2017 02:21

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