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Thermally-induced strain in FCBGA microelectronics package subjected to transient temperature loading

Kamsah, Nazri and Mohd. Top, Nurul Nadiah (2009) Thermally-induced strain in FCBGA microelectronics package subjected to transient temperature loading. In: The 2nd International Meeting on Advances in Thermo-Fluids (IMAT) 2009 , 2009, Taman Safari, Bogor, Indonesia.

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Item Type:Conference or Workshop Item (Paper)
Subjects:T Technology > TP Chemical technology
Divisions:Mechanical Engineering
ID Code:16064
Deposited By: Liza Porijo
Deposited On:18 Oct 2011 09:46
Last Modified:18 Oct 2011 09:46

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