Kamsah, Nazri and Mohd. Top, Nurul Nadiah (2009) Thermally-induced strain in FCBGA microelectronics package subjected to transient temperature loading. In: The 2nd International Meeting on Advances in Thermo-Fluids (IMAT) 2009 , 2009, Taman Safari, Bogor, Indonesia.
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| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | T Technology > TP Chemical technology |
| Divisions: | Mechanical Engineering |
| ID Code: | 16064 |
| Deposited By: | Liza Porijo |
| Deposited On: | 18 Oct 2011 09:46 |
| Last Modified: | 18 Oct 2011 09:46 |
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