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Fatigue of Sn-4Ag-0.5Cu solder joints during cyclic bending of a BGA assembly

Lai, Zheng B. and Loh, Wei K. and Tamin, Mohd. Nasir (2009) Fatigue of Sn-4Ag-0.5Cu solder joints during cyclic bending of a BGA assembly. In: 11th International Conference on Electronics Materials and Packaging (EMAP 2009), 2009, Hotel Gurney, P.Pinang.

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Item Type:Conference or Workshop Item (Paper)
Subjects:T Technology > TJ Mechanical engineering and machinery
Divisions:Mechanical Engineering
ID Code:15183
Deposited By: Liza Porijo
Deposited On:22 Sep 2011 09:55
Last Modified:22 Sep 2011 09:55

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