Lai, Zheng B. and Loh, Wei K. and Tamin, Mohd. Nasir (2009) Fatigue of Sn-4Ag-0.5Cu solder joints during cyclic bending of a BGA assembly. In: 11th International Conference on Electronics Materials and Packaging (EMAP 2009), 2009, Hotel Gurney, P.Pinang.
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| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | T Technology > TJ Mechanical engineering and machinery |
| Divisions: | Mechanical Engineering |
| ID Code: | 15183 |
| Deposited By: | Liza Porijo |
| Deposited On: | 22 Sep 2011 09:55 |
| Last Modified: | 22 Sep 2011 09:55 |
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