Universiti Teknologi Malaysia Institutional Repository

Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/Pd/Au surface finishes

F., Nor Akmal and A., Ourdjini and M. A., Azmah Hanim and I., Siti Aisha and Y. T., Chin (2007) Effect of solder bump size on interfacial reactions during soldering between Pb-free solder and Cu and Ni/Pd/Au surface finishes. In: National Metallurgical Conference 2007 (NMC 2007), 2007, Johor Bahru.

Full text not available from this repository.


Item Type:Conference or Workshop Item (Paper)
Uncontrolled Keywords:solder bump, Pb-free solder, Ni/Pd/Au
Subjects:T Technology > TJ Mechanical engineering and machinery
Divisions:Mechanical Engineering
ID Code:13942
Deposited By: Liza Porijo
Deposited On:16 Aug 2011 09:57
Last Modified:06 Nov 2012 01:38

Repository Staff Only: item control page